Solid-state imaging device and electronic apparatus including a photoelectric conversion unit disposed between another photoelectric conversion unit and a photoelectric conversion film

摘要

A solid-state imaging device which includes, a photoelectric conversion film provided on a second surface side which is the opposite side to a first surface on which a wiring layer of a semiconductor substrate is formed, performs photoelectric conversion with respect to light in a predetermined wavelength region, and transmits light in other wavelength regions; and a photoelectric conversion layer which is provided in the semiconductor substrate, and performs the photoelectric conversion with respect to light in other wavelength regions which has transmitted the photoelectric conversion film, in which input light is incident from the second surface side with respect to the photoelectric conversion film and the photoelectric conversion layer.

主权项

1. An imaging device comprising:
a substrate having a first side and a second side as a light incident side, the substrate including:
a first photoelectric conversion unit, anda second photoelectric conversion unit; a wiring layer disposed adjacent to the first side of the substrate; and a photoelectric conversion film disposed over the second side of the substrate, wherein,
at least a portion of the second photoelectric conversion unit is disposed between the first photoelectric conversion unit and the photoelectric conversion film, andthe substrate is disposed between the photoelectric conversion film and the wiring layer.