OLED package method and OLED package structure

摘要

The present invention provides an OLED package method and an OLED package structure. The method comprises steps of: step 1, providing a package cover plate (1), and a substrate (5), and the package cover plate (1) is formed with a spreading location (8) for spreading sealant (2); step 2, manufacturing a seal ring (7 or 7′) on the package cover plate (1) outside the spreading location (8); step 3, spreading the sealant (1) in a round on the spreading location (8) of the package cover plate (1); step 4, oppositely attaching the package cover plate (1) and the substrate (5); step 5, employing an UV light source to irradiate and curing the sealant (2) to accomplish the package to the substrate (5) with the package cover plate (1).

主权项

1. An organic light emitting diode (OLED) package method, comprising steps of:
step 1, providing a package cover plate and a substrate, wherein the package cover plate is formed with a spreading location for spreading sealant; step 2, manufacturing a seal ring on the package cover plate outside the spreading location, wherein the seal ring is formed of an inorganic material or a combination of an inorganic material and a metal material; step 3, spreading the sealant in a round on the spreading location of the package cover plate such that the sealant is located inboard of the seal ring; step 4, oppositely attaching the package cover plate and the substrate; step 5, employing ultraviolet (UV) light source to irradiate and cure the sealant to accomplish the package to the substrate with the package cover plate.