Integrated circuit package with plated heat spreader

摘要

An integrated circuit package may include an integrated circuit die with lower and upper surfaces. The integrated circuit die is mounted on a package substrate. An underfill material is deposited between the integrated circuit die and the package substrate. A molding compound may be injected to surround the integrated circuit die while leaving the upper surface of the integrated circuit die exposed. The integrated circuit package further includes a metal layer that contacts the exposed upper surface of the integrated circuit die. The metal layer may also cover the molding compound. If desired, an additional metal layer may be formed on the layer of metal as a heat spreader. Such a configuration may also be applicable for wire bond packages, in which the metal layers are formed on an overmold that is disposed over a wire-bonded integrated circuit die on a package substrate.

主权项

1. A method of packaging an integrated circuit die, comprising:
mounting the integrated circuit die on a package substrate to form an integrated circuit package; forming a metal layer on the integrated circuit package, wherein the metal layer directly contacts the integrated circuit die and includes first and second heat conducting layers of the same width; and forming molding compound between the metal layer and the package substrate.