Wet cleaning method for cleaning small pitch features

摘要

A method for reducing contaminants in a semiconductor device is provided. The method includes cleaning the semiconductor substrate. The cleaning includes rotating the semiconductor substrate and dispersing an aerosol at a predetermined temperature to a surface of the semiconductor substrate or a layer formed on the substrate to be cleaned. The aerosol includes a chemical having a predetermined pressure and a gas having a predetermined flow rate.

主权项

1. A method of cleaning a semiconductor substrate, the method comprising:
providing a semiconductor substrate, the semiconductor substrate having a major surface; rotating the semiconductor substrate; and dispersing an aerosol from a nozzle at a predetermined temperature to a surface of the semiconductor substrate to be cleaned, the aerosol having a first aerosol size, the aerosol comprising:
a chemical agent having a predetermined pressure; anda gas agent having a predetermined flow rate; and providing a laser beam or pulse laser irradiation beam impinging upon the aerosol at or near the nozzle to produce a laser assisted energetic aerosol formed by the laser beam or pulse laser irradiation beam prior to the aerosol coming into contact with the surface of the semiconductor substrate, the laser assisted energetic aerosol having a second aerosol size, the second aerosol size smaller than the first aerosol size, the laser beam or pulse laser irradiation beam incident to the aerosol in a direction substantially parallel to the major surface of the semiconductor substrate.