Semiconductor device having antenna and method for manufacturing thereof

摘要

The present invention provides an antenna in that the adhesive intensity of a conductive body formed on a base film is increased, and a semiconductor device including the antenna. The invention further provides a semiconductor device with high reliability that is formed by attaching an element formation layer and an antenna, wherein the element formation layer is not damaged due to a structure of the antenna. The semiconductor device includes the element formation layer provided over a substrate and the antenna provided over the element formation layer. The element formation layer and the antenna are electrically connected. The antenna has a base film and a conductive body, wherein at least a part of the conductive body is embedded in the base film. As a method for embedding the conductive body in the base film, a depression is formed in the base film and the conductive body is formed therein.

主权项

1. A semiconductor device comprising:
an element formation layer over and in contact with a substrate, the element formation layer comprising a thin film transistor, an interlayer insulating film over the thin film transistor and a wiring over the interlayer insulating film; a connection terminal over and in contact with the wiring; an anisotropic conductive film over the element formation layer and the connection terminal, the anisotropic conductive film comprising a conductive material; and an antenna over the anisotropic conductive film, wherein the antenna includes a film and a conductive body, wherein the wiring and the conductive body are electrically connected to each other via the connection terminal and the conductive material, wherein a bottom surface of the film includes a depression formed by pressing a mold against the film, wherein the depression has a stepped shape in a cross section, wherein the conductive body is in the depression, wherein the film is in contact with the anisotropic conductive film, and wherein a bottom surface of the conductive body is flush with the bottom surface of the film.