Chemically amplified positive-type photosensitive resin composition

摘要

A chemically amplified positive-type photosensitive resin composition capable of suppressing the phenomenon of footing in which the width of the bottom (the side proximal to the surface of a support) becomes narrower than that of the top (the side proximal to the surface of a resist layer) when a resist pattern serving as a template for a plated article is formed on a metal surface of a substrate using the composition. A mercapto compound is contained in the composition which includes an acid generator capable of producing an acid when irradiated with an active ray or radiation and a resin whose solubility in alkali increases under the action of acid.

主权项

1. A method of manufacturing a substrate with a template, the method comprising:
laminating a photosensitive resin layer on a metal surface of a substrate, the layer comprising a composition comprising: (A) an acid generator that produces an acid upon irradiation with an active ray or radiation; (B) a resin whose solubility in alkali increases under the action of acid; (C) a mercapto compound represented by a formula (1);wherein R1 and R2 each independently represents a hydrogen atom or an alkyl group; R3 represents an alkylene group; R4 represents an aliphatic group with a valency of u optionally containing an atom other than a carbon atom; and u represents an integer of 2 to 4; and
(E) an acid diffusion suppressing agent comprising at least one compound selected from the group consisting of malonic acid, succinic acid, benzoic acid, salicylic acid, phosphonic acid and derivatives of phosphonic acid; irradiating the layer with an active ray or radiation; and developing the layer after the exposure to create a template that defines a plated article wherein a resist pattern serving as the template is a pattern of the photosensitive resin layer after development, is formed so as to suppress footing that the width of the metal surface side of a resist layer becomes narrower than that of the surface side of the resist layer in a nonresist section, wherein the metal surface of the substrate comprises a metal species selected from the group consisting of copper, gold and aluminum.