MULTICHIP MODULE, ON BOARD COMPUTER, SENSOR INTERFACE SUBSTRATE, AND THE MULTICHIP MODULE MANUFACTURING METHOD

摘要

A multichip module includes a plurality of semiconductor substrates and a plurality of surface mounting parts. The plurality of semiconductor substrates each have a wiring line region which contains a wiring line to pierce from one of the surfaces to the other surface. A plurality of surface mounting parts are mounted on either of the plurality of surface mounting parts. The plurality of semiconductor substrates are stacked to form a multilayer structure. The first surface mounting part as at least one of the plurality of surface mounting parts is arranged in an inside region of the multilayer structure.

主权项

1. A multichip module comprising:
a plurality of semiconductor substrates, each of which has a wiring line region in which a wiring line passes through the semiconductor substrate from one surface toward another surface; and a plurality of surface mounting parts mounted on any of the plurality of semiconductor substrates, wherein the plurality of semiconductor substrates are stacked to form a multilayer structure, and wherein a first surface mounting part as at least one of the plurality of surface mounting parts is arranged in an inner region of the multilayer structure.