| 摘要 |
A water cooling system on a board module level comprises: a device subrack (1), provided with a backplate (2); multiple board modules (3), located on one side of the backplate (2); multiple board water-cooling modules (4), mounted on the corresponding board modules (3) and having a liquid for cooling a heating element of the board modules (3); multiple sealing and plug-connection units (5) mounted on the backplate (2) and connected to the board water-cooling modules (4); and multiple water pumps (11) connected to the multiple board water-cooling modules (4) by means of the multiple sealing and plug-connection units (5), wherein the water pumps (11) are located on the other side of the backplate (2). The water cooling system on a board module level has a simple structure, saves space, and has a high device maintenance efficiency. |
