| 摘要 |
An environment sensor, comprising an external packaging and an ASIC chip (3) and a sensor chip (4) positioned inside the external packaging, said external packaging comprising a circuit board (1); the ASIC chip (3) is soldered onto the circuit board (1) by means of embedded solder balls (5), the output end of the ASIC chip (3) is electrically connected to an ASIC output end lead (7) provided on the circuit board (1), the sensor chip (4) is soldered onto the top end of the ASIC chip (3) by means of embedded solder balls (5), and the input end of the sensor chip (4) is electrically connected to the output end of the ASIC chip (3); the external packaging is further provided with a channel that exposes the sensor chip (4) to the external environment. By positioning the sensor chip (4) and the ASIC chip (3) vertically in the external packaging, external packaging space is economized, thereby allowing for product miniaturization. |
