METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE

摘要

In a method for manufacturing a semiconductor device, a resin layer including an inorganic filler is molded on a surface of a substrate which includes semiconductor elements attached thereto by an adhesive, and terminals electrically connected to the semiconductor elements on another surface thereof. The molded substrate is cut so as to expose a conductive body electrically connected to an external terminal maintainable at ground potential. The surface of the resin layer of the substrate is sputter-etched in a vacuum environment, in a state where a plurality of the cut substrates is provided in a tray so that the surface of the substrate faces the tray. A metal layer is sputtered so as to be electrically connected to the conductive body on the surface and the cut surface in a state where the substrate is provided in the tray while maintaining the vacuum environment after sputter-etching.

主权项

1. A method for manufacturing a semiconductor device, comprising:
molding a sealing resin layer, including an inorganic filler therein, on a surface of a substrate which includes a plurality of semiconductor elements attached thereto by an adhesive, the substrate further including external input and output terminals disposed on another surface thereof electrically connected to the semiconductor elements; cutting the molded substrate so as to expose a conductive body therein having a terminal portion electrically connectable to an external input and output terminal, the external input and output terminal configured to be connectable to a ground potential; positioning the cut molded substrates in a tray such that a surface of the sealing resin layer is exposed and an opposed surface of the cut molded substrate faces a surface of the tray; sputter-etching, in a sub-atmospheric pressure environment, the exposed surface of the sealing resin layer; and sputtering a metal layer over the sealing resin layer and the cut portion of the molded substrate in a sub-atmospheric pressure environment to electrically connect the metal layer to the conductive body on the surface of the cut surface while the cut molded substrate is located on the tray, wherein during the sputter-etching, at least a portion of the inorganic filler in the sealing resin is exposed.