| 发明名称 |
RADIATION-SENSITIVE RESIN COMPOSITION AND ELECTRONIC DEVICE |
| 摘要 |
A radiation-sensitive resin composition comprising a binder resin (A), a radiation-sensitive compound (B), a tetrafunctional or lower functional epoxy-based cross-linking agent (C) having an epoxy equivalent of 450 or less and a softening point of 30° C., or less, and an aralkyl phenol resin (D) is provided. According to the present invention, it is possible to provide a radiation-sensitive resin composition able to give a resin film high in adhesion to a metal layer and excellent in developability and low hygroscopicity. |
| 申请公布号 |
US2017023859(A1) |
申请公布日期 |
2017.01.26 |
| 申请号 |
US201515124630 |
申请日期 |
2015.03.18 |
| 申请人 |
ZEON CORPORATION |
发明人 |
Tsutsumi Takashi |
| 分类号 |
G03F7/023 |
主分类号 |
G03F7/023 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A radiation-sensitive resin composition comprising a binder resin (A), a radiation-sensitive compound (B), a tetrafunctional or lower functional epoxy-based cross-linking agent (C) having an epoxy equivalent of 450 or less and a softening point of 30° C. or less, and an aralkyl phenol resin (D). |
| 地址 |
Tokyo JP |
