| 摘要 |
PROBLEM TO BE SOLVED: To provide a technique for removing an electronic component from a circuit board without applying excessive thermal stress and mechanical stress on an electronic component mounted on a circuit board.SOLUTION: A method for manufacturing an electronic device including a circuit board and an electronic component mounted on the circuit board includes the steps of: forming a recessed part at a place joined to a solder bump of the electronic component in the circuit board; detachably engaging a pad to be joined to the solder bump of the electronic component, relative to the recessed part; and solder joining the pad and the solder bump. |
