| 摘要 |
PROBLEM TO BE SOLVED: To provide a wafer processing method that is able to reduce the possibility of damaging not only a wafer but also devices when dividing the wafer into chips.SOLUTION: A wafer processing method comprises: a groove formation step in which the surface of a device wafer in which devices 15 are formed in corresponding chip areas separated by a plurality of dividing lines 13 formed on the surface is sealed with a sealing material 23, a plurality of bumps 25 are formed in the corresponding chip areas of the surface of the sealing material, a groove 29 is formed in the sealing material on the dividing line based on the bumps so as to be wider than the dividing lines and so as not to reach the surface of the device wafer, and cut residual parts 31 of predetermined thickness are left on the sealing material; a dividing-line detection step in which the dividing lines are detected by imaging means 40 sensitive to a wavelength that is transmissive with respect to the sealing material; and a dividing step in which a wafer is processed along the detected dividing lines, thereby dividing the wafer into individual chips. |
