发明名称 レーザー加工装置
摘要 PROBLEM TO BE SOLVED: To provide a laser processing device capable of forming a laser processing groove obliquely without inclining a condenser.SOLUTION: Laser beam irradiation means comprises: pulse laser beam oscillation means; a condenser; a 1/2 wavelength plate disposed between the pulse laser beam oscillation means and the condenser; polarization vector adjustment means for adjusting the polarization vector of a passing pulse laser beam; and control means. The control means controls the processing feeding speed of processing feeding means so as to position the spot center of a next pulse laser beam inside a key hole KH formed on the upper surface of a processed article W by irradiation with the pulse laser beam, and the polarization vector adjustment means to achieve a polarization vector LBB where the P-polarized light of the applied pulse laser beam is positioned on one side from the center of the key hole in the wall surface of the processing direction front side of the key hole and the S-polarized light of the applied pulse laser beam is positioned on the other side.
申请公布号 JP6068062(B2) 申请公布日期 2017.01.25
申请号 JP20120193397 申请日期 2012.09.03
申请人 株式会社ディスコ 发明人 桐原 直俊
分类号 B23K26/042;B23K26/00;B23K26/40;H01L21/301 主分类号 B23K26/042
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