| 摘要 |
A method for manufacturing a semiconductor light emitting element, and a semiconductor light emitting element. The method comprises: providing a first substrate (20); providing a semiconductor epitaxial laminated layer (110); providing a first adhering layer (135) to connect the first substrate (20) and the semiconductor epitaxial laminated layer (110); patterning the semiconductor epitaxial laminated layer (110) into multiple epitaxial units and separating them from each other from the first substrate (20); providing a second substrate (30) having a surface; transferring the multiple second epitaxial units onto the surface of the second substrate (30); and cutting the first substrate (20) to form multiple first semiconductor light emitting elements and cutting the second substrate (30) to form multiple second semiconductor light emitting elements. The multiple epitaxial units comprise multiple first epitaxial units (201) and multiple second epitaxial units (202). Each of the first epitaxial units (201) has a first geometrical shape and a first area, and each of the second epitaxial units (202) has a second geometrical shape and a second area. The first geometrical shape is different from the second geometrical shape or the first area is different from the second area. |
