发明名称 Light emitting device
摘要 This disclosure relates to a light-emitting apparatus comprising a submount, a chip carrier formed on the submount, a light-emitting chip formed on the chip carrier, a reflecting cup formed on the submount and enclosing the light-emitting chip and the chip carrier, and a transparent encapsulating material for encapsulating the light-emitting chip.
申请公布号 US9553243(B2) 申请公布日期 2017.01.24
申请号 US201414246319 申请日期 2014.04.07
申请人 EPISTAR CORPORATION 发明人 Hsieh Min-Hsun;Hsu Ta-Cheng;Tsai Meng-Lun;Lu Chih-Chiang;Wang Chien-Yuan;Chen Yen-Wen;Lee Ya-Ju
分类号 H01L33/50;H01L33/64;H01L33/60;H01L33/48;H01L33/54;H01L33/62 主分类号 H01L33/50
代理机构 Ditthavong & Steiner, P.C. 代理人 Ditthavong & Steiner, P.C.
主权项 1. A light-emitting device, comprising: a submount having a upper surface, a lower surface, and an outermost lateral surface; an LED chip; a chip carrier arranged between the upper surface and the LED chip; a first conductive line penetrating the submount, and having a first end exposed on the upper surface and connected to the LED chip, and a second end exposed on the lower surface without touching the outermost lateral surface; a light converting layer covering the LED chip and the chip carrier without directly contacting the LED chip; and a transparent material entirely covering the chip carrier and the first end of the first conductive line that is exposed on the upper surface, covering the LED chip without directly contacting the light converting layer, and directly contacting the submount.
地址 Hsinchu TW