Substrate dividing method

摘要

A substrate dividing method which can thin and divide a substrate while preventing chipping, and cracking from occurring. This substrate dividing method comprises the steps of irradiating a semiconductor substrate 1 having a front face 3 formed with functional devices 19 with laser light while positioning a light-converging point within the substrate, so as to form a modified region including a molten processed region due to multiphoton absorption within the semiconductor substrate 1, and causing the modified region including the molten processed region to form a starting point region for cutting; and grinding a rear face 21 of the semiconductor substrate 1 after the step of forming the starting point region for cutting such that the semiconductor substrate 1 attains a predetermined thickness.

主权项

1. A method of manufacturing a semiconductor device formed using a substrate dividing method, the manufacturing method comprising the steps of:
irradiating a laser light incident face of a substrate, the substrate comprising semiconductor material and having a surface formed with at least one semiconductor device, with laser light while positioning a light-converging point within the substrate, thereby forming a molten processed region embedded within the substrate along each line of a plurality of cutting lines arranged in a grid with respect to the substrate, the substrate having a front face and a rear face through the substrate, the front face of the substrate being formed with at least one functional device, the forming of each molten processed region resulting in the forming of a starting point region for cutting the substrate, each molten processed region being located inside the substrate at a predetermined distance from the laser light incident face of the substrate; and grinding the rear face of the substrate after the step of forming the starting point regions, thereby eliminating the molten processed regions from the substrate, wherein the substrate comprises at least a portion of a fracture generated in a thickness direction of the substrate and extending from each starting point region after completion of the grinding step, and wherein opposing fracture surfaces resulting from the generating of at least a portion of each fracture extending from each molten processed region are in contact with each other during performance of the grinding step; dividing the substrate, wherein the substrate is divided when each fracture reaches the front face and the rear face of the substrate, thereby providing at least one manufactured semiconductor device.