发明名称 Microchannel heat transfer with liquid metals
摘要 A apparatus for controlling heat transfer between portions of a substrate is provided. The apparatus includes a substrate including at least part of a hydraulic circuit, the hydraulic circuit including a plurality of microconduits, the plurality of microconduits including a first microconduit and a second microconduit. The apparatus further includes a liquid metal flowing through the hydraulic circuit and a magnetic field configured to selectively direct the flow of the liquid metal between the plurality of microconduits. The flow of the liquid metal through the hydraulic circuit transfers heat between a first portion of the substrate and the liquid metal.
申请公布号 US9554487(B2) 申请公布日期 2017.01.24
申请号 US201213627509 申请日期 2012.09.26
申请人 Elwha LLC 发明人 Glew Andrew F.;Hyde Roderick A.;Kare Jordin T.;Wood, Jr. Lowell L.
分类号 H05K7/20;F28F7/02;F28F27/02 主分类号 H05K7/20
代理机构 Foley & Lardner LLP 代理人 Foley & Lardner LLP
主权项 1. An apparatus for controlling heat transfer between portions of a substrate comprising: a substrate including at least part of a hydraulic circuit, the hydraulic circuit comprising a plurality of microconduits, the plurality of microconduits including a first microconduit and a second microconduit; a liquid metal flowing through the hydraulic circuit; and a magnetic field source configured to provide a magnetic field to selectively direct the flow of the liquid metal between the plurality of microconduits; wherein the flow of the liquid metal through the hydraulic circuit transfers heat between a first portion of the substrate and the liquid metal; and wherein the magnetic field is activated to initiate the flow of the liquid metal in a desired direction and is inactivated after the flow is initiated such that the flow of liquid metal continues in the desired direction through the hydraulic circuit via surface tension.
地址 Bellevue WA US