发明名称 |
Microchannel heat transfer with liquid metals |
摘要 |
A apparatus for controlling heat transfer between portions of a substrate is provided. The apparatus includes a substrate including at least part of a hydraulic circuit, the hydraulic circuit including a plurality of microconduits, the plurality of microconduits including a first microconduit and a second microconduit. The apparatus further includes a liquid metal flowing through the hydraulic circuit and a magnetic field configured to selectively direct the flow of the liquid metal between the plurality of microconduits. The flow of the liquid metal through the hydraulic circuit transfers heat between a first portion of the substrate and the liquid metal. |
申请公布号 |
US9554487(B2) |
申请公布日期 |
2017.01.24 |
申请号 |
US201213627509 |
申请日期 |
2012.09.26 |
申请人 |
Elwha LLC |
发明人 |
Glew Andrew F.;Hyde Roderick A.;Kare Jordin T.;Wood, Jr. Lowell L. |
分类号 |
H05K7/20;F28F7/02;F28F27/02 |
主分类号 |
H05K7/20 |
代理机构 |
Foley & Lardner LLP |
代理人 |
Foley & Lardner LLP |
主权项 |
1. An apparatus for controlling heat transfer between portions of a substrate comprising:
a substrate including at least part of a hydraulic circuit, the hydraulic circuit comprising a plurality of microconduits, the plurality of microconduits including a first microconduit and a second microconduit; a liquid metal flowing through the hydraulic circuit; and a magnetic field source configured to provide a magnetic field to selectively direct the flow of the liquid metal between the plurality of microconduits; wherein the flow of the liquid metal through the hydraulic circuit transfers heat between a first portion of the substrate and the liquid metal; and wherein the magnetic field is activated to initiate the flow of the liquid metal in a desired direction and is inactivated after the flow is initiated such that the flow of liquid metal continues in the desired direction through the hydraulic circuit via surface tension. |
地址 |
Bellevue WA US |