发明名称 Tamper-respondent assemblies with enclosure-to-board protection
摘要 Tamper-respondent assemblies and fabrication methods are provided which incorporate enclosure to circuit board protection. The tamper-respondent assemblies include a circuit board, and an electronic enclosure mounted to the circuit board and facilitating enclosing at least one electronic component within a secure volume. A tamper-respondent electronic circuit structure facilitates defining the secure volume, and the tamper-respondent electronic circuit structure includes a tamper-respondent circuit. An adhesive is provided to secure, in part, the electronic enclosure to the circuit board. The adhesive contacts, at least in part, the tamper-respondent circuit so that an attempted separation of the electronic enclosure from the circuit board causes the adhesive to break the tamper-respondent circuit, facilitating detection of the separation by a monitor circuit of the tamper-respondent electronic circuit structure.
申请公布号 US9554477(B1) 申请公布日期 2017.01.24
申请号 US201514974036 申请日期 2015.12.18
申请人 INTERNATIONAL BUSINESS MACHINES CORPORATION 发明人 Brodsky William L.;Busby James A.;Cohen Edward N.;Dragone Silvio;Fisher Michael J.;Long David C.;Peets Michael T.;Santiago-Fernandez William;Weiss Thomas
分类号 G08B21/00;H05K5/02;H05K1/02;H05K1/18 主分类号 G08B21/00
代理机构 Heslin Rothenberg Farley & Mesiti P.C. 代理人 McNamara, Esq. Margaret A.;Radigan, Esq. Kevin P.;Heslin Rothenberg Farley & Mesiti P.C.
主权项 1. A tamper-respondent assembly comprising: a circuit board; an electronic enclosure mounted to the circuit board and facilitating enclosing at least one electronic component within a secure volume; a tamper-respondent electronic circuit structure facilitating defining the secure volume, the tamper-respondent electronic circuit structure comprising a tamper-respondent circuit; an adhesive securing, in part, the electronic enclosure to the circuit board, the adhesive contacting, at least in part, the tamper-respondent circuit of the tamper-respondent electronic circuit structure, wherein separation of the electronic enclosure from the circuit board causes the adhesive to break the tamper-respondent circuit, thereby facilitating detection of the separation; wherein the adhesive covers, at least in part, the tamper-respondent circuit; wherein the adhesive is disposed at an inner periphery of an enclosure-to-board interface where the electronic enclosure mounts to the circuit board; and wherein the tamper-respondent circuit comprises a plurality of surface-mount components electrically connected in series and spaced along the circuit board at the inner periphery of the enclosure-to-board interface.
地址 Armonk NY US
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