| 发明名称 |
SEMICONDUCTOR DEVICE |
| 摘要 |
A semiconductor device includes a first circuit board having a first chip and a second chip mounted on a first base, the second chip having a greater height from the first base than that of the first chip; and a second circuit board having a third chip and a fourth chip mounted on a second base, the fourth chip having a greater height from the second base than that of the third chip, the second circuit board being disposed overlapping with the first base such that the second base faces the first chip, and the second base not contacting the second chip. |
| 申请公布号 |
US2017018528(A1) |
申请公布日期 |
2017.01.19 |
| 申请号 |
US201615189533 |
申请日期 |
2016.06.22 |
| 申请人 |
FUJITSU LIMITED |
发明人 |
NABEKURA Hideaki |
| 分类号 |
H01L25/065;H01L25/18;H01L23/00;H01L23/498;H01L23/538 |
主分类号 |
H01L25/065 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A semiconductor device comprising:
a first circuit board having a first chip and a second chip mounted on a first base, with the second chip having a greater height from the first base than that of the first chip; and a second circuit board having a third chip and a fourth chip mounted on a second base, the fourth chip having a greater height from the second base than that of the third chip, with the second circuit board disposed overlapping with the first circuit board such that the second base faces the first chip, and the second base not contacting the second chip. |
| 地址 |
Kawasaki-shi JP |
