发明名称 PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD
摘要 Disclosed is a plasma processing apparatus for performing a processing on a processing target substrate by applying of plasma of a processing gas to the processing target substrate. The plasma processing apparatus includes: a processing container configured to removably accommodate the processing target substrate; a lower electrode provided in the processing container to place the processing target substrate thereon; an upper electrode provided in the processing container to face the lower electrode; a high frequency power source configured to apply a high frequency power between the upper electrode and the lower electrode; and an electromagnet having one or more annular coils around a central axis that passes through a center of the lower electrode vertically in an upper portion or at an upper side of the processing container.
申请公布号 US2017018407(A1) 申请公布日期 2017.01.19
申请号 US201515124589 申请日期 2015.02.26
申请人 TOKYO ELECTRON LIMITED 发明人 KONDO Takashi
分类号 H01J37/32;H01L21/67;H01L21/311 主分类号 H01J37/32
代理机构 代理人
主权项 1. A plasma processing apparatus for performing a processing on a processing target substrate by applying plasma of a processing gas to the processing target substrate, the apparatus comprising: a processing container configured to removably accommodate the processing target substrate; a lower electrode provided in the processing container to place the processing target substrate thereon; an upper electrode provided in the processing container to face the lower electrode; a high frequency power source configured to apply a high frequency power between the upper electrode and the lower electrode; and an electromagnet having one or a plurality of annular coils around a central axis that passes through a center of the lower electrode vertically, in an upper portion or at an upper side of the processing container.
地址 Tokyo JP