发明名称 |
REVIEW OF SUSPECTED DEFECTS USING ONE OR MORE REFERENCE DIES |
摘要 |
A system for reviewing a wafer, the system may include a memory unit that is configured to store information about locations of a set of suspected defects that are located at multiple dice of the wafer; electron optics that is configured to obtain images of reference elements, wherein the reference elements are located within a first reference die of the wafer; and a processor that is configured to: compare the first sub-set of suspected defects to a first sub-set of reference elements to provide a first evaluation result; and select, in response to the first evaluation result, a source of a second sub-set of reference elements. The electron optics is further configured to obtain images of a second sub-set of reference elements that are located within a second reference die of the wafer when it is determined that the second reference die is the source of the second sub-set of reference elements. The processor is further configured to compare the second sub-set of suspected defects to the second sub-set of reference elements to provide a second evaluation result. |
申请公布号 |
US2017018398(A1) |
申请公布日期 |
2017.01.19 |
申请号 |
US201514798153 |
申请日期 |
2015.07.13 |
申请人 |
APPLIED MATERIALS ISRAEL LTD. |
发明人 |
Greenberg Ofir;Gronau Yuval |
分类号 |
H01J37/22;H01J37/28 |
主分类号 |
H01J37/22 |
代理机构 |
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代理人 |
|
主权项 |
1. A system for reviewing a wafer, the system comprising:
a memory unit configured to store information about locations of a set of suspected defects that are located at multiple dice of the wafer; electron optics configured to obtain images of reference elements located within a first reference die of the wafer; a processor configured to: compare a first sub-set of suspected defects to a first sub-set of reference elements to provide a first evaluation result; and select, in response to the first evaluation result, a source of a second sub-set of reference elements; wherein the electron optics are further configured to obtain images of a second sub-set of reference elements that are located within a second reference die of the wafer when it is determined that the second reference die is the source of the second sub-set of reference elements; and wherein the processor is further configured to compare a second sub-set of suspected defects to the second sub-set of reference elements to provide a second evaluation result. |
地址 |
Rehovot IL |