Semiconductor Device and Method of Manufacture

摘要

An integrated fan out package on package architecture is utilized along with a reference via in order to provide a reference voltage that extends through the InFO-POP architecture. If desired, the reference via may be exposed and then connected to a shield coating that can be used to shield the InFO-POP architecture. The reference via may be exposed by exposing either a top surface or a sidewall of the reference via using one or more singulation processes.

主权项

1. A semiconductor device comprising:
a semiconductor die encased in an encapsulant; first vias extending through the encapsulant and separated from the semiconductor die by the encapsulant; at least one reference via extending through the encapsulant, wherein the semiconductor die, the first vias, and the at least one reference via are part of a first integrated fan out package; and a second semiconductor device electrically connected to the first vias but not electrically connected to the at least one reference via.