SEMICONDUCTOR PACKAGE INCLUDING AN ANTENNA FORMED IN A GROOVE WITHIN A SEALING ELEMENT

摘要

There are provided a semiconductor package including an antenna formed integrally therewith, and a method of manufacturing the same. The semiconductor package includes: a semiconductor chip; a sealing part sealing the semiconductor chip; a substrate part formed on at least one surface of the sealing part; and an antenna part formed on the sealing part or the substrate part and electrically connected to the semiconductor chip.

主权项

1. A semiconductor package comprising:
a semiconductor chip; a sealing layer formed on, and configured to seal, the semiconductor chip, wherein the sealing layer contacts and seals top and side surfaces of the semiconductor chip; a substrate layer disposed on at least one surface of the sealing layer; an antenna disposed on the sealing layer and electrically connected to the semiconductor chip; and a connection via electrically connecting the antenna to a lower surface of the sealing layer, wherein the substrate layer comprises a first material and the sealing layer comprises a second material different from the first material.