SUSPENSION BOARD ASSEMBLY SHEET HAVING CIRCUITS, METHOD OF MANUFACTURING THE SAME AND METHOD OF INSPECTING THE SAME

摘要

A suspension board and an inspection substrate are integrally supported by a support frame. In the suspension board, first and second insulating layers are laminated on a support substrate in this order. Part of a line is formed on the first insulating layer, and the remaining line is formed on the second insulating layer. A via connecting the part of the line to the remaining line is formed in the second insulating layer. In the inspection substrate, the first and second insulating layers are laminated on the support substrate in this order. A first inspection conductor layer is formed on the first insulating layer, and a second inspection conductor layer is formed on the second insulating layer. A via connecting the first inspection conductor layer to the second inspection conductor layer is formed in the second insulating layer.

主权项

1. A suspension board assembly sheet having circuits, comprising:
a plurality of suspension boards having circuits; an inspection substrate; and a support frame that integrally supports the plurality of suspension boards having circuits and the inspection substrate, wherein each of the plurality of suspension boards having circuits includes a conductive circuit support substrate, a first circuit insulating layer formed on the circuit support substrate, a first conductor line formed on the first circuit insulating layer, a second circuit insulating layer formed on the first circuit insulating layer to cover at least part of the first conductor line, a second conductor line formed on the second circuit insulating layer, and a first circuit via that electrically connects the first conductor line to the second conductor line through the second circuit insulating layer, the inspection substrate includes a conductive inspection support substrate, a first inspection insulating layer formed on the inspection support substrate, a first inspection conductor layer formed on the first inspection insulating layer, a second inspection insulating layer formed on the first inspection insulating layer to cover at least part of the first inspection conductor layer, a second inspection conductor layer formed on the second inspection insulating layer, and a first inspection via that electrically connects the first inspection conductor layer to the second inspection conductor layer through the second inspection insulating layer, and the first circuit via and the first inspection via have a same configuration.