SUBSTRATE LIQUID PROCESSING APPARATUS AND METHOD

摘要

The present invention relates to a substrate liquid processing apparatus which etches and cleans a substrate for a semiconductor. The substrate liquid processing apparatus comprises: a substrate supporting part for supporting a substrate on the top of a table being spaced apart from the substrate so that a surface to be processed is facing the bottom of the table; a rotational driving part for driving a rotation axis which rotates the table; and a processing liquid supplying part for supplying, in a processing space between the table and the substrate, processing liquid in a mist state in which gas is mixed or processing liquid in a steam state. According to the substrate liquid processing apparatus, it is possible to uniformize an atmosphere of the processing space between the substrate and the table, and to uniformly spray the processing liquid on the surface to be processed.