发明名称 |
MULTI-CHIP MODULE, ON-BOARD COMPUTER, SENSOR INTERFACE SUBSTRATE, AND MULTI-CHIP MODULE MANUFACTURING METHOD |
摘要 |
A multichip module includes a plurality of semiconductor substrates and a plurality of surface mounting parts. The plurality of semiconductor substrates each have a wiring line region which contains a wiring line to pierce from one of the surfaces to the other surface. A plurality of surface mounting parts are mounted on either of the plurality of surface mounting parts. The plurality of semiconductor substrates are stacked to form a multilayer structure. The first surface mounting part as at least one of the plurality of surface mounting parts is arranged in an inside region of the multilayer structure. |
申请公布号 |
EP3104410(A4) |
申请公布日期 |
2017.01.18 |
申请号 |
EP20150762051 |
申请日期 |
2015.01.28 |
申请人 |
Mitsubishi Heavy Industries, Ltd. |
发明人 |
KATO Masahiro;KURODA Yoshikatsu |
分类号 |
H01L25/00;H01L23/498;H01L25/065;H01L25/07;H01L25/18;H05K1/18 |
主分类号 |
H01L25/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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