HEAT-CURABLE EPOXY RESIN COMPOSITION FOR OPTICAL SEMICONDUCTOR ELEMENT ENCAPSULATION AND OPTICAL SEMICONDUCTOR DEVICE USING SAME

摘要

A heat-curable epoxy resin composition for optical semiconductor element encapsulation capable of being pressure molded and transfer molded under room temperature, comprising:
(A) a prepolymer obtained by reacting at least one component of (A-1), (A-2) and (A-3); and (A-4),
(A-1) a triazine derivative epoxy resin having not less than three epoxy groups in one molecule,
(A-2) at least one epoxy resin that is non-fluid at 25°C and selected from the group consisting of a bisphenol-type epoxy resin, a hydrogenated bisphenol-type epoxy resin, an alicyclic epoxy resin and monoalkyl diglycidyl isocyanurate,
(A-3) a cyclic siloxane compound having not less than two epoxy groups in one molecule, and
(A-4) an acid anhydride curing agent in a liquid state at 25°C;
(A') a component(s) among (A-1) to (A-3) that is/are not used in said prepolymer (A); and
(B) a curing accelerator.