Isolation rings for packages and the method of forming the same

摘要

A device includes a first package component, and a second package component underlying, and bonded to, the first package component. A molding material is disposed under the first package component and molded to the first and the second package components, wherein the molding material and the first package component form an interface. An isolation region includes a first edge, wherein the first edge of the isolation region contacts a first edge of the first package component and a first edge of the molding material. The isolation has a bottom lower than the interface.

主权项

1. A method comprising:
bonding a first package component with a second package component; encapsulating the second package component in a molding material; forming a trench in the first package component, with the molding material exposed to the trench, wherein the forming the trench comprises:
performing a first grooving to form a wide portion of the trench, wherein the wide portion extends from a surface of the first package component into the molding material; andperforming a second grooving to form a first narrow portion extending from a bottom of the wide portion into the molding material, wherein the first narrow portion is narrower than the wide portion; filling an isolation material into the trench to form an isolation region; and sawing through the isolation region and the molding material to form a package.