METHOD FOR PRODUCING A COOLABLE ELECTRONIC COMPONENT AND ASSEMBLY COMPRISING AN ELECTRONIC COMPONENT AND A COOLING ELEMENT

摘要

The invention relates to a method for producing a coolable electronic component (12) by a cooling element (13) being connected to said component. According to the invention, it is provided that the connection is produced by pushing, also called direct bonding, wherein the joining surfaces of the electronic component (12) and of the cooling element (13) are so smooth that adhesion forces lead to a cohesive connection at a transition between these two components (15). This cohesive connection can be further strengthened by subsequent cold-welding. The advantage of the resulting transition (15) is a thermal resistance which is lower in comparison to transitions with a joining aid, and for this reason heat can advantageously be drawn from the electronic component (12) by the cooling element (13) more effectively. An assembly which has been produced in accordance with said method also forms the subject matter of the invention.