发明名称 |
METHOD AND APPARATUS FOR LIGHT-IRRADIATION HEAT TREATMENT |
摘要 |
Light is applied for preheating from a halogen lamp to a lower surface of a semiconductor wafer supported on a susceptor within a chamber. Thereafter, flash light is applied for flash heating from a flash lamp to an upper surface of the semiconductor wafer. High-temperature treatment gas heated by a heater is supplied into the chamber to preheat a structure inside the chamber including a susceptor before heat treatment for an initial semiconductor wafer of a lot starts. By raising the temperature of the structure inside the chamber to a temperature substantially equivalent to a temperature of the structure during steady treatment, all semiconductor wafers constituting the lot are supportable on the susceptor maintained at a constant temperature without the necessity of dummy running. Accordingly, a temperature history is equalized for all the semiconductor wafers. |
申请公布号 |
US2017011923(A1) |
申请公布日期 |
2017.01.12 |
申请号 |
US201615189446 |
申请日期 |
2016.06.22 |
申请人 |
SCREEN Holdings Co., Ltd. |
发明人 |
TANIMURA Hideaki;FUSE Kazuhiko |
分类号 |
H01L21/225;H01L21/324;H01L21/67;H05B3/00 |
主分类号 |
H01L21/225 |
代理机构 |
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代理人 |
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主权项 |
1. A heat treatment method that heats a substrate by irradiating the substrate with light, comprising steps of:
(a) transporting the substrate into a chamber; (b) applying light to the substrate transported into said chamber; and (c) raising a temperature of a structure inside said chamber by supplying heated treatment gas into said chamber before an initial substrate of a lot is transported to said chamber. |
地址 |
Kyoto JP |