发明名称 METHOD AND APPARATUS FOR LIGHT-IRRADIATION HEAT TREATMENT
摘要 Light is applied for preheating from a halogen lamp to a lower surface of a semiconductor wafer supported on a susceptor within a chamber. Thereafter, flash light is applied for flash heating from a flash lamp to an upper surface of the semiconductor wafer. High-temperature treatment gas heated by a heater is supplied into the chamber to preheat a structure inside the chamber including a susceptor before heat treatment for an initial semiconductor wafer of a lot starts. By raising the temperature of the structure inside the chamber to a temperature substantially equivalent to a temperature of the structure during steady treatment, all semiconductor wafers constituting the lot are supportable on the susceptor maintained at a constant temperature without the necessity of dummy running. Accordingly, a temperature history is equalized for all the semiconductor wafers.
申请公布号 US2017011923(A1) 申请公布日期 2017.01.12
申请号 US201615189446 申请日期 2016.06.22
申请人 SCREEN Holdings Co., Ltd. 发明人 TANIMURA Hideaki;FUSE Kazuhiko
分类号 H01L21/225;H01L21/324;H01L21/67;H05B3/00 主分类号 H01L21/225
代理机构 代理人
主权项 1. A heat treatment method that heats a substrate by irradiating the substrate with light, comprising steps of: (a) transporting the substrate into a chamber; (b) applying light to the substrate transported into said chamber; and (c) raising a temperature of a structure inside said chamber by supplying heated treatment gas into said chamber before an initial substrate of a lot is transported to said chamber.
地址 Kyoto JP