发明名称 |
PROCESS KIT HAVING TALL DEPOSITION RING AND DEPOSITION RING CLAMP |
摘要 |
Embodiments of process kits and process chambers incorporating same are provided herein. In some embodiments, a process kit includes a deposition ring configured to be disposed on a substrate support designed to support a substrate having a given width, including: an annular band configured to rest on a lower ledge of the substrate support; an inner lip extending upwardly from an inner edge of the annular band, wherein an inner surface of the inner lip and an inner surface of the annular band together form a central opening having a width that is less than the given width, and wherein a depth between an upper surface of the annular band and an upper surface of the inner lip is between about 24 mm and about 38 mm; a channel disposed radially outward of the annular band; and an outer lip extending upwardly and disposed radially outward of the channel. |
申请公布号 |
WO2017007729(A1) |
申请公布日期 |
2017.01.12 |
申请号 |
WO2016US40847 |
申请日期 |
2016.07.01 |
申请人 |
APPLIED MATERIALS, INC. |
发明人 |
JOHANSON, William;SAVANDAIAH, Kirankumar;ALLEN, Adolph Miller;WANG, Xin;PRABHU, Prashant |
分类号 |
C23C14/50;C23C14/34 |
主分类号 |
C23C14/50 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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