| 发明名称 |
MEMS Devices and Fabrication Methods Thereof |
| 摘要 |
A device includes a carrier having a plurality of cavities, a micro-electro-mechanical system (MEMS) substrate bonded on the carrier, wherein the MEMS substrate comprises a first side bonded on the carrier, a moving element over a bottom electrode, wherein the bottom electrode is formed of polysilicon and a second side having a plurality of bonding pads and a semiconductor substrate bonded on the MEMS substrate, wherein the semiconductor substrate comprises a top electrode and the first moving element is between the top electrode and the bottom electrode. |
| 申请公布号 |
US2017008758(A1) |
申请公布日期 |
2017.01.12 |
| 申请号 |
US201615276212 |
申请日期 |
2016.09.26 |
| 申请人 |
Taiwan Semiconductor Manufacturing Company, Ltd. |
发明人 |
Chu Chia-Hua;Cheng Chun-Wen;Lee Te-Hao;Lin Chung-Hsien |
| 分类号 |
B81B3/00 |
主分类号 |
B81B3/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A semiconductor device comprising:
a carrier having a plurality of cavities; a micro-electro-mechanical system (MEMS) substrate bonded on the carrier, wherein the MEMS substrate comprises:
a first side bonded on the carrier;a first moving element over a bottom electrode, wherein the bottom electrode is formed of polysilicon; anda second side having a plurality of bonding pads; and a semiconductor substrate bonded on the MEMS substrate, wherein the semiconductor substrate comprises a top electrode, and wherein the first moving element is between the top electrode and the bottom electrode. |
| 地址 |
Hsin-Chu TW |
