| 摘要 |
A measurement apparatus includes: a projection optical system; an illumination unit; an imaging unit configured to image a target onto which pattern light has been projected by the projection optical system, thereby capturing a first image of the target by the pattern light reflected by the target; and a processing unit configured to obtain information on the shape of the target. The illumination unit includes light emitters arranged around an optical axis of the projection optical system symmetrically with respect to the optical axis. The processing unit corrects the first image by using a second image of the target and obtains the shape information on the basis of the corrected image, wherein the imaging unit images the target object illuminated by the light emitters to capture the second image by light emitted from the light emitters and reflected by the target object. |
