MULTI-STACKED ELECTRONIC DEVICE WITH DEFECT-FREE SOLDER CONNECTION

摘要

A method includes forming a multi-stacked electronic device having two or more electronic components, each of the electronic components includes a leadframe, the leadframes of each electronic component are physically joined together using a non-solder metal joining process to form a joint, and the joint is located outside a solder connection region.

主权项

1. An electronic structure comprising:
a substrate having an upper soldering surface; a stacked electronic device having at least first and second electronic components, the first electronic component including a lateral, outside downwardly extending first leadframe, the second electronic component including a lateral, upwardly extending leadframe, the second leadframe extending upwardly, laterally inside of, and vertically overlapping with, the first leadframe, wherein the first and second leadframes include respective overlapping portions, and the first leadframe includes a lower portion spaced from said overlapping portions and defining a solder connection region for soldering the stacked electronic device to a soldering surface; a joint located outside the solder connection region, and directly between and physically joining together the overlapping portions of the first and second leadframes to join the first and second electronic components together; and a solder connection below and spaced from the joint and joining the solder connection region of the stacked electronic device to the soldering surface, the solder connection including a solder material having a melting point lower than a melting point of the joint.