| 发明名称 |
ELECTRICAL COMPONENT AND ELECTRONIC DEVICE |
| 摘要 |
An electrical component includes a contact point part that establishes an electrical connection by contact. In addition, the contact point part includes: a substrate having a metal as a constituent material; and a thin film arranged at a surface of the substrate. Moreover, the thin film includes a π-accepting molecule having a π-acceptability, in which the π-accepting molecule has a size of ligand field splitting in a spectrochemical series larger than or equal to a size of ligand field splitting of 2,2′-bipyridyl. |
| 申请公布号 |
US2017012377(A1) |
申请公布日期 |
2017.01.12 |
| 申请号 |
US201615200350 |
申请日期 |
2016.07.01 |
| 申请人 |
DENSO CORPORATION |
发明人 |
OCHI Kenji |
| 分类号 |
H01R12/72;H05K1/11;H01R13/03 |
主分类号 |
H01R12/72 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. An electrical component comprising:
a contact point part that establishes an electrical connection by contact, wherein the contact point part includes:
a substrate having a metal as a constituent material; anda thin film arranged at a surface of the substrate, and wherein the thin film includes a π-accepting molecule having a π-acceptability, in which the π-accepting molecule has a size of ligand field splitting in a spectrochemical series larger than or equal to a size of ligand field splitting of 2,2′-bipyridyl. |
| 地址 |
Kariya-city JP |
