发明名称 Method of manufacturing a silicon wafer
摘要 A method of manufacturing a silicon wafer provides a silicon wafer which can reduce the precipitation of oxygen to prevent a wafer deformation from being generated and can prevent a slip extension due to boat scratches and transfer scratches serving as a reason for a decrease in wafer strength, even when the wafer is provided to a rapid temperature-rising-and-falling thermal treatment process.
申请公布号 EP2722423(B1) 申请公布日期 2017.01.11
申请号 EP20140151040 申请日期 2010.03.25
申请人 Sumco Corporation 发明人 Ono, Toshiaki;Ito, Wataru;Fujise, Jun
分类号 C30B33/02;C30B29/06;H01L21/20;H01L21/26;H01L21/322 主分类号 C30B33/02
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