| 摘要 |
A method and a device for cutting a laminate including at least one glass layer with a thickness less than or equal to 0.3 mm and including at least one polymeric layer are disclosed. The method includes generating a surface scratch on a first surface of the glass layer, wherein the scratch, starting from a lateral edge, extends along a cutting line. The method further includes moving a first laser beam, starting from the scratch, across the first surface along the cutting line. The method also includes cooling the glass layer along the cutting line, wherein the glass layer breaks along the cutting line The polymeric layer is severed by moving a second laser beam along the cutting line. The device includes means for cutting the laminate according to the disclosed method. |
