| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a wiring board capable of improving adhesion between a through conductor and a wiring conductor layer and manufacturing a wiring board with excellent connection reliability.SOLUTION: A through conductor formation step forms a through hole 26 penetrating a wiring conductor layer 23 and a resin insulating layer 22 and forms a via conductor 27 connected to the wiring conductor layer 23 by filling the through hole 26 with a conductive paste. A fine particle conductor arrangement step forms a fine particle conductor layer 51 by applying a conductive paste containing a fine particle conductor onto an end surface of the via conductor 27. The fine particle conductor in which the fine particle conductor layer 51 is formed has an average particle size smaller than an average particle size of a conductor particle included in the conductive paste of the via conductor 27 and is not more than 1 μm. A conductor adhesion step interposes a conductor layer 29 composed of a fine particle conductor in a boundary part between the wiring conductor layer 23 and the via conductor 27. |
