发明名称 電子部品の工程処理装置及び工程処理方法並びに工程処理用プログラム
摘要 PROBLEM TO BE SOLVED: To provide a process-processing technique having excellent conveyance efficiency and processing efficiency of an electronic component, and capable of ensuring a long process-processing time at a low cost with less additional mechanism.SOLUTION: A process-processing apparatus of an electronic component includes an electronic component conveyance section including a plurality of electronic component holding mechanisms, and a processing section including a drive mechanism for lifting and lowering the holding mechanisms individually, and a processing mechanism performing process-processing of an electronic component. The holding mechanism coming to a position corresponding to a processing mechanism of the same type is set to install the electronic components simultaneously for all processing mechanisms of the same type, and to release the electronic components simultaneously from all processing mechanisms of the same type after ending the processing of the electronic components. Processing mechanisms other than those of the same type perform the processing in the processing time of the processing mechanisms of the same type. The drive mechanism lifts and lowers the holding mechanism at a position corresponding to the processing mechanism of the same type, and the holding mechanism at a position corresponding to a processing mechanism other than the same type, in the different operation patterns.
申请公布号 JP6057303(B2) 申请公布日期 2017.01.11
申请号 JP20140115846 申请日期 2014.06.04
申请人 上野精機株式会社 发明人 井浦 和彦
分类号 H01L21/50;G01R31/26;H01L21/677 主分类号 H01L21/50
代理机构 代理人
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