发明名称 半導体装置
摘要 PROBLEM TO BE SOLVED: To provide a semiconductor device that allows preventing element breakdown at a termination region.SOLUTION: A semiconductor device includes; a first electrode; a first-conductivity-type first semiconductor layer provided on the first electrode; a second-conductivity-type second semiconductor layer provided on the first semiconductor layer; a first-conductivity-type third semiconductor layer provided on the second semiconductor layer and having higher first-conductivity-type impurity concentration than the first semiconductor layer; gate electrodes provided in the third semiconductor layer via an insulating film along a first direction; a second electrode electrically connected to the second semiconductor layer and the third semiconductor layer; and contact regions electrically connecting the second electrode and the second semiconductor layer, provided spaced apart from each other in the first direction, and having nonconstant width.
申请公布号 JP6058712(B2) 申请公布日期 2017.01.11
申请号 JP20150027595 申请日期 2015.02.16
申请人 株式会社東芝 发明人 冨田 幸太;松田 昇;浦 秀幸
分类号 H01L29/78;H01L29/06 主分类号 H01L29/78
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