| 发明名称 |
Light emitting diode package and method for manufacturing same |
| 摘要 |
An LED packaging includes a substrate having a top surface and a bottom surface opposite to the top surface, a recess defined in the top surface, an LED mounted on the top surface of the substrate, a zener diode received in the recess, and a reflecting layer formed in the recess and enclosing the zener diode therein. |
| 申请公布号 |
US9543283(B2) |
申请公布日期 |
2017.01.10 |
| 申请号 |
US201414310575 |
申请日期 |
2014.06.20 |
| 申请人 |
ADVANCED OPTOELECTRONIC TECHNOLOGY, INC. |
发明人 |
Lin Hou-Te;Yeh Fu-Hsiang;Chang Chao-Hsiung;Chen Pin-Chuan;Chen Lung-Hsin |
| 分类号 |
H01L33/00;H01L25/16;H01L33/48 |
主分类号 |
H01L33/00 |
| 代理机构 |
|
代理人 |
Ma Zhigang |
| 主权项 |
1. A light emitting diode (LED) packaging comprising:
a substrate having a top surface and a bottom surface opposite to the top surface, a recess defined in the top surface; an LED mounted on the top surface of the substrate; a zener diode received in the recess; and a reflecting layer formed in the recess and the reflecting layer enclosing the zener diode therein; wherein the substrate comprises a first electrode, a second electrode, the second electrode is cuboidal and located at a corner of the substrate, the first electrode has an L-shaped configuration, the zener diode is arranged on the second electrode and electrically connects the first electrode and the second electrode. |
| 地址 |
Hsinchu Hsien TW |
