Semiconductor package with a lead, package-on-package device including the same, and mobile device including the same

摘要

A semiconductor package includes a substrate; a first semiconductor chip arranged on the substrate; a second semiconductor chip arranged on the first semiconductor chip; a lead attached to the second semiconductor chip on a side of the second semiconductor chip opposite a side of the second semiconductor chip facing the first semiconductor chip; and a molding member covering an upper surface of the substrate and side surfaces of the lead and sealing the first semiconductor chip and the second semiconductor chip.

主权项

1. A package-on-package device comprising:
a memory package comprising:
a first semiconductor chip arranged on a substrate;a second semiconductor chip arranged on the first semiconductor chip;a lead attached to the second semiconductor chip on a side of the second semiconductor chip opposite a side of the second semiconductor chip facing the first semiconductor chip; anda molding member covering an upper surface of the substrate and side surfaces of the lead and sealing the first semiconductor chip and the second semiconductor chip; a system semiconductor package comprising a logic chip arranged on a system semiconductor substrate; and a semiconductor package having a structure in which the memory package and the system semiconductor package are stacked.