| 发明名称 | Electronic component module and an assembly including the same | ||
| 摘要 | An electronic component module includes a board, a plurality of external terminals provided on a first surface of the board, and a first semiconductor chip provided on a region on the first surface surrounded by the plurality of external terminals. The first semiconductor chip protrudes more along a normal to the first surface than ends of the external terminals do. | ||
| 申请公布号 | US9545026(B2) | 申请公布日期 | 2017.01.10 |
| 申请号 | US201514612271 | 申请日期 | 2015.02.02 |
| 申请人 | PANASONIC CORPORATION | 发明人 | Fukuda Toshiyuki;Kodera Keisuke;Itou Fumito;Miyoshi Toshihiro |
| 分类号 | H05K7/02;H01L23/00;H01L25/16;H01L23/13;H01L23/34;H01L23/367;H01L23/538;H01L23/66 | 主分类号 | H05K7/02 |
| 代理机构 | McDermott Will & Emery LLP | 代理人 | McDermott Will & Emery LLP |
| 主权项 | 1. An electronic component module, comprising: a board; a plurality of external terminals provided on a first surface of the board; a first semiconductor chip provided on a region on the first surface surrounded by the plurality of external terminals; and a wiring portion provided on a second surface of the board opposite to the first surface, wherein the wiring portion is electrically connected with at least one of the plurality of external terminals, and the first semiconductor chip protrudes more along a normal to the first surface than ends of the external terminals do. | ||
| 地址 | Osaka JP | ||