| 发明名称 | Self-illuminating CMOS imaging package | ||
| 摘要 | A microelectronics chip contains an integrated CMOS imaging sensor integrated with a LED die. Circuitry is established on the chip for a shared power arrangement. | ||
| 申请公布号 | US9538909(B2) | 申请公布日期 | 2017.01.10 |
| 申请号 | US201313936844 | 申请日期 | 2013.07.08 |
| 申请人 | OmniVision Technologies, Inc. | 发明人 | Lei Junzhao;Tsau Guannho G. |
| 分类号 | H01L27/15;A61B1/06;A61B1/05;H01L31/173;H01L25/16 | 主分类号 | H01L27/15 |
| 代理机构 | Lathrop & Gage LLP | 代理人 | Lathrop & Gage LLP |
| 主权项 | 1. In a microelectronics chip bearing a complementary metal oxide semiconductor (CMOS) image sensor, the improvement comprising: a Gallium-Arsenide (GaAs)-based substrate including (i) a first portion that is a component of the CMOS image sensor, and (ii) a second portion that is a component of a light emitting diode (LED), at least one of (a) the first portion being implanted with a first element and (b) the second portion being implanted with a second element different from the first element. | ||
| 地址 | Santa Clara CA US | ||