发明名称 |
Golf ball with encapsulated RFID chip |
摘要 |
A spherical compressible ball having an RFID tag is described. The ball comprises an RFID integrated circuit, an encapsulating material, a first antenna contact, a first conductive wire, a molded compressible core, and a molded shell. The RFID integrated circuit includes a memory that stores a unique identifier. The encapsulating material encapsulates the RFID integrated circuit. The first antenna contact is electrically coupled to the encapsulated RFID integrated circuit. The first conductive wire is electrically coupled to the first antenna contact. The molded compressible core includes a molded impression that receives the encapsulated RFID integrated circuit and the conductive wire. The molded shell further encapsulates the molded compressible core that receives the encapsulated RFID integrated circuit and antenna. |
申请公布号 |
US9539471(B2) |
申请公布日期 |
2017.01.10 |
申请号 |
US201213444679 |
申请日期 |
2012.04.11 |
申请人 |
EDGE TECHNOLOGY |
发明人 |
Luciano, Jr. Robert;White Warren;Grieshaber David |
分类号 |
G08B13/14;A63B43/00;A63B37/00;B29C43/18;B29C43/02;A63B24/00 |
主分类号 |
G08B13/14 |
代理机构 |
Kerr IP Group, LLC |
代理人 |
Kerr Michael A.;Kerr IP Group, LLC |
主权项 |
1. A spherical compressible ball having an RFID tag, the ball comprising,
an RFID integrated circuit that includes a memory configured to store at least one unique identifier; an encapsulating material that encapsulates the RFID integrated circuit to form an encapsulated RFID integrated circuit; a plurality of RFID contact pads that are electrically coupled to the encapsulated RFID integrated circuit; a wire that is electrically coupled to one of the plurality of RFID contact pads; a plurality of stranded wires that is electrically coupled to the wire, the wire having a thickness that is greater than a thickness of the plurality of stranded wires; a molded compressible core that includes a molded impression configured to receive the encapsulated RFID integrated circuit and the plurality of stranded wires; and a molded shell that further encapsulates the molded compressible core. |
地址 |
Reno NV US |