RESIN COMPOSITION, RESIN LAMINATE AND RESIN LAMINATED METALLIC FOIL

摘要

The present invention is a resin composition containing a crosslinking auxiliary agent and a specific modified block copolymer hydride [E] resulting from introducing an alkoxy silyl group; a resin laminate in which a layer comprising the resin composition is laminated on at least one surface of a polyimide resin film; and a resin laminated metallic foil in which a metal foil is laminated on at least one surface of the polyimide resin film, with a layer comprising the resin composition interposed therebetween. According to the present invention, provided are: a novel resin composition having excellent adhesion to a polyimide resin film and a low-surface-roughness metal foil, and excellent electrical insulating properties; a resin laminate in which the resin composition and the polyimide resin film are laminated; and a resin laminated metallic foil in which the low-surface-roughness metal foil and a polyimide resin film that is suitable for the manufacture of high density flexible printed boards are laminated using the resin composition as an adhesive.