| 摘要 |
An OLED encapsulating method and OLED device. The method comprises: providing a substrate (401) to be encapsulated and a cover plate (403); forming a conductive frame (402) on the substrate (401) to be encapsulated; aligning the cover plate (403) with the substrate (401) to be encapsulated formed with the frame (402) thereon to obtain a preform; and immersing the preform into an electroplating bath, and electrifying the frame (402) so as to form a layer of metal thin film (404) on a surface of the frame (402) adjacent to a periphery of the substrate (401). By electroplated with a layer of metal thin film (404), of which the compact structure provides a better barrier performance against moisture and oxygen than a frame sealant, at the periphery of the frame (402), an OLED device manufactured via the encapsulating method has a better seal and better performance. |
