发明名称 |
Ultra High Voltage Device |
摘要 |
According to an embodiment, a semiconductor device is provided. The device includes: The second region has a greater curvature than the first region. The device includes: an N-type epitaxy layer; a P-well in the N-type epitaxy layer; a drain in the N-type epitaxy layer; a source in the P-well; and a bulk in the P-well and in contact with the source, wherein the bulk has a greater area in the second region than in the first region. |
申请公布号 |
US2017005194(A1) |
申请公布日期 |
2017.01.05 |
申请号 |
US201615265118 |
申请日期 |
2016.09.14 |
申请人 |
Taiwan Semiconductor Manufacturing Company Limited |
发明人 |
TSAI MING-FU;SU YU-TI;TSENG JEN-CHOU |
分类号 |
H01L29/78;H01L29/08;H01L29/06 |
主分类号 |
H01L29/78 |
代理机构 |
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代理人 |
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主权项 |
1. A semiconductor device having a first region and a second region, the second region having a greater curvature than the first region, the device comprising:
an N-type epitaxy layer in the first region and the second region; a P-well in the N-type epitaxy layer; a first N+ diffusion layer in the N-type epitaxy layer; a second N+ diffusion layer in the P-well; and a P+ diffusion layer in the P-well and separated from the second N+ diffusion layer, wherein a distance between the P+ diffusion layer and the second N+ diffusion layer is smaller in the second region than in the first region. |
地址 |
Hsinchu TW |