发明名称 |
PROCESS KIT HAVING TALL DEPOSITION RING AND DEPOSITION RING CLAMP |
摘要 |
Embodiments of process kits and process chambers incorporating same are provided herein. In some embodiments, a process kit includes a deposition ring configured to be disposed on a substrate support designed to support a substrate having a given width, including: an annular band configured to rest on a lower ledge of the substrate support; an inner lip extending upwardly from an inner edge of the annular band, wherein an inner surface of the inner lip and an inner surface of the annular band together form a central opening having a width that is less than the given width, and wherein a depth between an upper surface of the annular band and an upper surface of the inner lip is between about 24 mm and about 38 mm; a channel disposed radially outward of the annular band; and an outer lip extending upwardly and disposed radially outward of the channel. |
申请公布号 |
US2017002461(A1) |
申请公布日期 |
2017.01.05 |
申请号 |
US201615201019 |
申请日期 |
2016.07.01 |
申请人 |
APPLIED MATERIALS, INC. |
发明人 |
JOHANSON William;SAVANDAIAH Kirankumar;ALLEN Adolph Miller;WANG Xin;PRABHU Prashant |
分类号 |
C23C16/455 |
主分类号 |
C23C16/455 |
代理机构 |
|
代理人 |
|
主权项 |
1. A process kit, comprising:
a deposition ring configured to be disposed on a substrate support designed to support a substrate having a given width, the deposition ring comprising:
an annular band configured to rest on a lower ledge of the substrate support;an inner lip extending upwardly from an inner edge of the annular band, wherein an inner surface of the inner lip and an inner surface of the annular band together form a central opening having a width that is less than the given width, and wherein a depth between an upper surface of the annular band and an upper surface of the inner lip is between about 24 mm and about 38 mm;a channel disposed radially outward of the annular band; andan outer lip extending upwardly and disposed radially outward of the channel. |
地址 |
Santa Clara CA US |